The post CEVA Collaborates with VisiSonics To Develop A Comprehensive 3D Spatial Audio Solution for Embedded Devices first appeared on Wearable Technologies.
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Wednesday, September 23, 2020
CEVA Collaborates with VisiSonics To Develop A Comprehensive 3D Spatial Audio Solution for Embedded Devices
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, and VisiSonics, a developer of best-in-class, patented 3D spatial audio technologies, have partnered to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones, and other hearables. Read more Aipower Wearbuds: Truly Wireless Earbuds Housed in a […]
from Wearable Technologies https://ift.tt/3cmwGi4
from Wearable Technologies https://ift.tt/3cmwGi4
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